Home >  Products > Wire To Board Connector > Wafer Housing Terminal > 3.96mm
PH3.96mm wafer, single row, DIP right angle type with bend plastic back wafer connectors

PH3.96mm wafer, single row, DIP right angle type with bend plastic back wafer connectors

Part No: L108XX-11X6XXX
Mating:
Packing:Bag
Delivery time:7~15 Day
UL: Yes
ROHS Compliant

product details

Specifications:

Rating current: 9.0AMP
Contact resistance: 10mΩ max
Withstand voltage: 1500V AC/minute
Insulation resistance: 1000mΩ min
Operation temperature: -25°C to + 85°C
Contact material: Brass
Contact plating: Au or Sn over Ni
Insulator material: LCP, NY6T, NY9T, PA66+30%GF

Contact Us
  • Tel: +86 755 2320 1015    +86 15019202015
  • E-mail: sales@liandaconn.com
  • Fax: +86 755 2998 7536
  • Skype: jodge2010
  • Shenzhen oversea &marketing department address: Room C220, Area C, Block B, West Silicon Vall, No. 5010, Baoan Road, Baoan District, Shenzhen, China (mainland), Guangdong, 518000, China
  • Dongguan factory address: Building A, No.10, Ludipu Industrial Park, Huaide community, Humen town, Dongguan, Guangdong, 523926, China
Follow Us